Ultra-thin rigid substrate
It is possible to manufacture a double-sided board with a substrate thickness of 0.04t while being a rigid substrate!
We would like to introduce our "Ultra-Thin Rigid Substrate." Thanks to our technology, we can manufacture double-sided substrates with a substrate thickness of 0.04t, while still being rigid. This is suitable for applications such as circuit boards for ultra-thin high-density devices. Please feel free to contact us when you need assistance. 【Applications】 ■ Circuit boards for ultra-thin high-density devices, etc. *For more details, please refer to the PDF document or feel free to contact us.
- Company：三和電子サーキット
- Price：Other
